Key Information

Paper Submission

Submit by email


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 Please Contact 

BIAFA Organizing 

Committee Members


Teacher Qu

QQ: 2026821258

Teacher Peng

QQ: 1317764162


Important Dates

Round 1

Submission Deadline: 

January 19, 2020

Registration Deadline: 

January 25, 2020

Round 2

Submission Deadline: 

February 28, 2020

Registration Deadline: 

March 5, 2020

Round 3

Submission Deadline: 

April 13, 2020

Registration Deadline: 

April 19, 2020

Conference Date

March 6-8, 2020


The big data industry mainly refers to the economic activities related to data resource-related big data analysis collection, storage, and organization management and application value optimization. It is a new type of electronic information industry, with big data as the core and covering network information infrastructure services. The field is deeply applied to all aspects of social politics, economy, culture and culture. It is also the necessary foundation for the development of the Internet of Things and the development of artificial intelligence. 

The 2020 International Conference on Big Data Computing and Information Processing, Artificial Intelligence Foundation and ApplicationBIAFA 2020will be held in NanjingChina from March 6 to 8, 2020, with a view to further promoting the exchange and development of big data and artificial intelligence industries in China and around the world, and making greater contributions to the national strategy of the Belt and Road and the progress of human civilization.


Accepted papers which meet the conference requirements would be published by IEEE and submitted to EI-Compendex, CPCI (ISTP) for indexing.

Instructions for Authors:

1. The article must be in English, not plagiarized, and no more than one manuscript;

2. All papers will be reviewed by 2-3 peer reviewers, and the review period is about 

    1-5 days;

3. The General Assembly follows the principle of “submission first, first review, 

    first submission” and publishes in batches.

4. Please submit your papers to official email:


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